IEC 61760-4:2015+AMD1:2018 CSV
Consolidated version
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Abstract
IEC 61760-4:2015+A1:2018 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering. This consolidated version consists of the first edition (2015) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2018-03-13 |
Edition | 1.1 |
Available language(s) | English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.190 - Electronic component assemblies |
Stability date | 2025 |
Pages | 132 |
File size | 1936 KB |
The following test report forms are related:
Share your publications
Learn how to share your publications with your colleagues, using networking options.
Payment information
Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa, JCB and CUP), PayPal and bank transfers as form of payment.
Keep in touch
Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.
Contact customer services
Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 16:00 CET Monday to Friday.