IEC TR 62878-2-7:2019
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
Abstract
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
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Additional information
| Publication type | Technical Report |
|---|---|
| Publication date | 2019-03-20 |
| Edition | 1.0 |
| Available language(s) | English |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards 31.190 - Electronic component assemblies |
| Stability date | 2029 |
| Pages | 12 |
| File size | 2725 KB |
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