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Publication detail

 
Reference P-IEC 60300-3-7 ed1.0 withdrawn corrigendum
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Title Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware
Publication date 1999-05-31
Format, price
(Swiss francs)
and language
190.- 69 pages
190.- 328 Kb
 
Abstract Serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The standard is intended as a guide to be used with one of the IEC reliability stress screening standards. It gives guidance in cases where it is essential that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. It gives guidance on where the reliability stress screening should be carried out, i.e. component, subsystem or system level.
Technical Committee 56 - Dependability  RSS
ICS Codes
03.120.01 Quality in general
*Including general aspects related to reliability and maintainability

31.020 Electronic components in general
*Magnetic components, see 29.100.10
 
Replaced by IEC 61163-1 ed2.0 (2006-06) (partial replacement)
IEC 61163-2 ed1.0 (1998-11) (partial replacement)
 

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