| Reference |
IEC 61163-1 ed2.0 withdrawn corrigendum |
 > preview
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| Title |
Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
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| Publication date |
2006-06-26 |
Format, price (Swiss francs) and language |
 | 290.- |
| 161 pages |  | 290.- |
| 1517 Kb |
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| Abstract |
This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.
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| Technical Committee |
56 - Dependability
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| ICS Codes |
| 03.120.01 |
Quality in general
*Including general aspects related to reliability and maintainability
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| 03.120.30 |
Application of statistical methods
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| 21.020 |
Characteristics and design of machines, apparatus, equipment
*Including reliability, dependability, maintainability, durability, etc.
*Safety of machinery, see 13.110 |
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| Replaced by |
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| Stability date |
2018 |
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| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
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