| Reference |
IEC 60191-2 DB-12M Subscription withdrawn corrigendum |
 > preview
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| Title |
Mechanical standardization of semiconductor devices - Part 2:
Dimensions
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Format, price (Swiss francs) and language |
 | 260.- |
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| Abstract |
Contains more than 220 standard sheets covering device outline drawings and the types of semiconductor devices generally mounted in the packages. Published in the IEC since 1966, the drawings given in this publication represent the unification of national standards. The database version of this publication avails the standard sheets in PDF format and it also provides search facilities for easy retrieval of the drawings.
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| Technical Committee |
47D - Semiconductor devices packaging
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| Work in progress |
| Project | Stage code | Forecast publication date |
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| No project under development | - | - |
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