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Publication detail

 
Reference P-IEC 61709 ed1.0 withdrawn corrigendum
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Title Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
Publication date 1996-10-17
Format, price
(Swiss francs)
and language
230.- 83 pages
230.- 662 Kb
 
Abstract Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.
Technical Committee 56 - Dependability  RSS
ICS Codes
31.020 Electronic components in general
*Magnetic components, see 29.100.10
 
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