Publication detail
| Reference | IEC 60191-2 ed1.0 |
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| Title | Mechanical standardization of semiconductor devices. Part 2: Dimensions | |||||||||
| Publication date | 1966-01-01 | |||||||||
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| Abstract | Consolidated reprint consisting of IEC 191-2 (1966) and supplements 60191-2A (1967), 60191-2B (1969), 60191-2C (1970), 60191-2D (1971), 60191-2E (1974), 60191-2F (1976), 60191-2G (1978), 60191-2H (1978), 60191-2J (1980), 60191-2K (1981), 60191-2L (1982), 60191-2M (1983), 60191-2N (1987), 60191-2P (1988), 60191-2Q (1990), 60191-2R (1995), 60191-2S (1995). The IEC standard drawings given in this publication represent the unification of national standards. This is a loose-leaf publication. | |||||||||
| Technical Committee | 47D - Semiconductor devices packaging
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| Stability date | 2013 | |||||||||
| Work in progress |
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