| Reference |
IEC 61249-5-1 ed1.0 withdrawn corrigendum |
 > preview
|
| Title |
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
|
| Publication date |
1995-11-28 |
Format, price (Swiss francs) and language |
 | 100.- |
| 39 pages |  | 100.- |
| 1424 Kb |
|
| |
| Abstract |
Gives requirements for properties of copper foil intended for use
in the manufacture of copper-clad laminated sheets and of
copper-clad flexible materials, used in the manufacture of
printed boards.
|
| Technical Committee |
91 - Electronics assembly technology
|
| ICS Codes |
| 31.180 |
Printed circuits and boards |
|
| |
| Replaced by |
|
| Stability date |
2013 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|