| Reference |
IEC 61709 ed1.0 withdrawn |
> preview
|
| Title |
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
|
| Publication date |
1996-10-17 |
Format, price
(Swiss francs)
and language |
 | 185.- |
| 83 pages |  | 204.- |
| 720 Kb |
|
| |
| Abstract |
Gives guidance on the use of failure rate data for the reliability
prediction of components in electronic equipment. Reference
conditions for failure rate data are specified, so that data from
different sources can be compared. The reference conditions adopted
are typical of the majority of applications of components in
equipment (e.g. telecommunication use, data processing). In this
standard it is assumed that the failure rate used under reference
conditions is specific to the component i.e. it includes the effect
of complexity, technology of the casing, dependence on
manufacturers and the manufacturing process, etc.
|
| Technical Committee |
56 - Dependability
|
| ICS Codes |
| 31.020 |
Electronic components in general
*Magnetic components, see 29.100.10
|
|
| Stability date |
2009 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| IEC 61709 Ed.2 |
CCDV | 2010-10-10 |
|
Search
Quick access by ref. number
Basket
Payment
Just Published
Bestsellers