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Publication detail

 
Reference IEC 61189-1 ed1.0 withdrawn corrigendum
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Title Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
Publication date 1997-03-27
Format, price
(Swiss francs)
and language
100.- 37 pages
100.- 129 Kb
 
Abstract This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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