International Electrotechnical Commission

Publication detail

Reference	IEC 61189-1 ed1.0 withdrawn corrigendum	> preview
Title	Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
Publication date	1997-03-27
Format, price (Swiss francs) and language	100.- 37 pages 100.- 129 Kb
Abstract	This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.180 Printed circuits and boards
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

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