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Publication detail

 
Reference IEC 61249-8-8 ed1.0 withdrawn corrigendum
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Title Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Publication date 1997-06-24
Format, price
(Swiss francs)
and language
40.- 19 pages
40.- 92 Kb
 
Abstract Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2013
 
Work in progress
ProjectStage codeForecast publication date
No project under development--

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