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Publication detail

 
Reference IEC 61188-1-2 ed1.0 withdrawn corrigendum
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Title Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
Publication date 1998-04-29
Format, price
(Swiss francs)
and language
230.- 83 pages
230.- 493 Kb
 
Abstract The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--

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