International Electrotechnical Commission

Publication detail

Reference	IEC 61191-3 ed1.0 withdrawn corrigendum	> preview
Title	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Publication date	1998-08-28
Format, price (Swiss francs) and language	70.- 31 pages 70.- 583 Kb
Abstract	Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.240 Mechanical structures for electronic equipment
Replaced by
Stability date	2014
Work in progress	Project Stage code Forecast publication date IEC 61191-3 Ed.2  AMW 2015-06-30

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