| Reference |
IEC 61163-2 ed1.0 withdrawn corrigendum |
 > preview
|
| Title |
Reliability stress screening - Part 2: Electronic components
|
| Publication date |
1998-11-27 |
Format, price (Swiss francs) and language |
 | 190.- |
| 69 pages |  | 190.- |
| 509 Kb |
|
| |
| Abstract |
Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of
a) component manufacturers as a guideline,
b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements,
c) subcontractors who provide stress screening as a service.
|
| Technical Committee |
56 - Dependability
|
| ICS Codes |
| 03.120.01 |
Quality in general
*Including general aspects related to reliability and maintainability
|
| 31.020 |
Electronic components in general
*Magnetic components, see 29.100.10 |
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| |
| Replaced by |
|
| Stability date |
2013 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|