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Publication detail

 
Reference IEC 61163-2 ed1.0 withdrawn corrigendum
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Title Reliability stress screening - Part 2: Electronic components
Publication date 1998-11-27
Format, price
(Swiss francs)
and language
190.- 69 pages
190.- 509 Kb
 
Abstract Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.
Technical Committee 56 - Dependability  RSS
ICS Codes
03.120.01 Quality in general
*Including general aspects related to reliability and maintainability

31.020 Electronic components in general
*Magnetic components, see 29.100.10
 
Replaced by
Stability date 2017
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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