| Reference |
IEC 61249-3-5 ed1.0 withdrawn corrigendum |
 > preview
|
| Title |
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
|
| Publication date |
1999-02-10 |
Format, price (Swiss francs) and language |
 | 50.- |
| 12 pages |  | 50.- |
| 69 Kb |
|
| |
| Abstract |
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
|
| Technical Committee |
91 - Electronics assembly technology
|
| ICS Codes |
| 31.180 |
Printed circuits and boards |
|
| |
| Replaced by |
|
| Stability date |
2013 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|