| Reference |
IEC 60191-4 ed2.0 withdrawn corrigendum |
 > preview
|
| Title |
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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| Publication date |
1999-10-08 |
Format, price (Swiss francs) and language |
 | 100.- |
| 39 pages |  | 100.- |
| 187 Kb |
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| Abstract |
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.
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| Technical Committee |
47D - Semiconductor devices packaging
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| ICS Codes |
| 31.080 |
Semiconductor devices
*Semiconducting materials, see 29.045 |
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| Replaced by |
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| Stability date |
2012 |
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| Work in progress |
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