| Reference |
IEC 60191-3 ed2.0 withdrawn corrigendum |
 > preview
|
| Title |
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
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| Publication date |
1999-10-29 |
Format, price (Swiss francs) and language |
 | 250.- |
| 113 pages |  | 250.- |
| 1431 Kb |
|
| |
| Abstract |
Gives guidance on the preparation of drawings of integrated circuits outlines.
|
| Technical Committee |
47D - Semiconductor devices packaging
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| ICS Codes |
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| Replaced by |
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| Stability date |
2015 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
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