International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-3 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
Publication date	2000-09-29
Format, price (Swiss francs) and language	80.- 17 pages 80.- 193 Kb
Abstract	Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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