International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-6 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Publication date	2001-03-22
Format, price (Swiss francs) and language	50.- 12 pages 50.- 143 Kb
Abstract	Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

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