International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-5 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Publication date	2001-08-27
Format, price (Swiss francs) and language	40.- 10 pages 40.- 309 Kb
Abstract	Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2012
Work in progress	Project Stage code Forecast publication date IEC 60191-6-5 Ed.2  NCD 2013-01-29

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