International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-1 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
Publication date	2001-10-30
Format, price (Swiss francs) and language	25.- 7 pages 25.- 235 Kb
Abstract	Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2021
Work in progress	Project Stage code Forecast publication date No project under development - -

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