| Reference |
IEC 61189-1 ed1.1 Consol. with am1 withdrawn corrigendum |
> preview
|
| Title |
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
|
| Publication date |
2001-11-22 |
Format, price
(Swiss francs)
and language |
 | 165.- |
| 51 pages |  | 165.- |
| 698 Kb |
|
| |
| Abstract |
This series relates to test methods for printed boards and printed
board assemblies, as well as related materials or component
robustness, irrespective of their method of manufacture.
This part contains test methods for evaluating printed boards and
other forms of interconnection structures. The methods are designed
to achieve uniformity and reproducibility in the procedures and
test methodologies.
This consolidated version consists of the first edition (1997)
and its amendment 1 (2001). Therefore, no need to order amendment in
addition to this publication.
|
| Technical Committee |
91 - Electronics assembly technology
|
| ICS Codes |
| 31.180 |
Printed circuits and boards |
|
| |
| Replaced by |
|
| Stability date |
2015 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|
Search
Quick access by ref. number
Basket
Payment
Just Published
Bestsellers