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Reference IEC 60191-6-2 ed1.0 withdrawn corrigendum
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Title Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Publication date 2001-12-11
Format, price
(Swiss francs)
and language
40.- 10 pages
40.- 318 Kb
 
Abstract Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages. The contents of the corrigendum of October 2002 have been included in this copy.
Technical Committee 47D - Semiconductor devices packaging  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2016
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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