International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-2 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Publication date	2001-12-11
Format, price (Swiss francs) and language	40.- 10 pages 40.- 318 Kb
Abstract	Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages. The contents of the corrigendum of October 2002 have been included in this copy.
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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