| Reference |
IEC 61193-1 ed1.0 withdrawn corrigendum |
 > preview
|
| Title |
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
|
| Publication date |
2001-12-19 |
Format, price (Swiss francs) and language |
 | 130.- |
| 41 pages |  | 130.- |
| 1063 Kb |
|
| |
| Abstract |
Defines methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations, and can serve as a basis for general quality improvement.
|
| Technical Committee |
91 - Electronics assembly technology
|
| ICS Codes |
| 31.190 |
Electronic component assemblies
*Including preassembled modules |
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| |
| Replaced by |
|
| Stability date |
2014 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|