International Electrotechnical Commission

Publication detail

Reference	IEC 60749-3 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
Publication date	2002-04-09
Format, price (Swiss francs) and language	16.- 7 pages 16.- 355 Kb
Abstract	Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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