| Reference |
IEC 60749-10 ed1.0 withdrawn corrigendum |
 > preview
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| Title |
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
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| Publication date |
2002-04-09 |
Format, price (Swiss francs) and language |
 | 16.- |
| 7 pages |  | 16.- |
| 393 Kb |
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| Abstract |
Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.
The contents of the corrigendum of August 2003 have been included in this copy.
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| Technical Committee |
47 - Semiconductor devices
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| ICS Codes |
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| Replaced by |
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| Stability date |
2016 |
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| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
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