| Reference |
IEC 60749-4 ed1.0 withdrawn corrigendum |
 > preview
|
| Title |
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
|
| Publication date |
2002-04-12 |
Format, price (Swiss francs) and language |
 | 30.- |
| 15 pages |  | 30.- |
| 484 Kb |
|
| |
| Abstract |
Provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.
The contents of the corrigendum of August 2003 have been included in this copy.
|
| Technical Committee |
47 - Semiconductor devices
|
| ICS Codes |
|
| |
| Replaced by |
|
| Stability date |
2016 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|