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Publication detail

 
Reference IEC 60749-9 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Publication date 2002-04-12
Format, price
(Swiss francs)
and language
18.- 9 pages
18.- 394 Kb
 
Abstract Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2016
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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