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Publication detail

 
Reference IEC 60748-23-2 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests
Publication date 2002-05-23
Format, price
(Swiss francs)
and language
300.- 97 pages
300.- 889 Kb
 
Abstract Applies to high quality approval systems for hybrid integrated circuits and film structures. The purpose of the tests is to perform visual inspections on the internal materials, construction and workmanship of hybrid, multichip and multichip module microcircuits and passive elements used for microelectronic applications including r.f./microwave. These tests will normally be used on microelectronic devices prior to capping or encapsulation to detect and eliminate devices with internal non-conformances that could lead to device failure in normal application. They may also be employed on a sampling basis to determine the effectiveness of the manufacturers' quality control and handling procedures.
Technical Committee 47A - Integrated circuits  RSS
ICS Codes
31.200 Integrated circuits. Microelectronics
*Including electronic chips, logical and analogue microstructures
*Microprocessors, see 35.160
 
Replaced by
Stability date 2016
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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