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Publication detail

 
Reference IEC 61188-5-1 ed1.0 withdrawn corrigendum
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Title Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Publication date 2002-07-12
Format, price
(Swiss francs)
and language
280.- 141 pages
280.- 6472 Kb
 
Abstract Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards

31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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