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Reference IEC 60191-6-1 ed1.0 withdrawn corrigendum

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Title Versión Oficial En español - Normalización mecánica de dispositivos semiconductores. Parte 6-1: Reglas generales para la preparación de los diseños de los paquetes de dispositivos semiconductores de montaje en superficie. Guía de diseño de los terminales en forma de ala de gaviota e
Publication date 2001-10-30
Format, price
(Swiss francs)
and language
25.- 9 pages
25.- 56 Kb
 
Abstract Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
Technical Committee 47D - Semiconductor devices packaging  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2021
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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