International Electrotechnical Commission

Publication detail

Reference	IEC 60749-22 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Publication date	2002-09-12
Format, price (Swiss francs) and language	130.- 41 pages 130.- 611 Kb
Abstract	Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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