International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-2 ed1.0 withdrawn corrigendum	no preview
Title	Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Publication date	2002-10-18
Download	Free download or Buy base publication
Abstract
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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