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Publication detail

 
Reference P-IEC 60191-4 ed2.2 Consol. with am1&2 withdrawn corrigendum
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Title Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Publication date 2002-10-22
Format, price
(Swiss francs)
and language
165.- 43 pages
165.- 1177 Kb
 
Abstract Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages. This consolidated version consists of the second edition (1999), its amendment 1 (2001) and its amendment 2 (2002). Therefore, no need to order amendments in addition to this publication.
Technical Committee 47D - Semiconductor devices packaging  RSS
ICS Codes
31.080 Semiconductor devices
*Semiconducting materials, see 29.045
 
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