International Electrotechnical Commission

Publication detail

Reference	IEC 60191-4 ed2.2 Consol. with am1&2 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Publication date	2002-10-22
Format, price (Swiss francs) and language	165.- 43 pages 165.- 1139 Kb
Abstract	Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages. This consolidated version consists of the second edition (1999), its amendment 1 (2001) and its amendment 2 (2002). Therefore, no need to order amendments in addition to this publication.
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080 Semiconductor devices *Semiconducting materials, see 29.045
Replaced by
Stability date	2012
Work in progress	Project Stage code Forecast publication date IEC 60191-4 Ed.3  RDIS 2013-11-30

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