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Publication detail

 
Reference IEC 61192-4 ed1.0 withdrawn corrigendum
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Title Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Publication date 2002-11-29
Format, price
(Swiss francs)
and language
170.- 59 pages
170.- 3679 Kb
 
Abstract Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--

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