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Publication detail

 
Reference IEC 61192-3 ed1.0 withdrawn corrigendum
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Title Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Publication date 2002-12-17
Format, price
(Swiss francs)
and language
230.- 93 pages
230.- 7622 Kb
 
Abstract Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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