International Electrotechnical Commission

Publication detail

Reference	IEC 60749-16 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Publication date	2003-01-17
Format, price (Swiss francs) and language	25.- 13 pages 25.- 171 Kb
Abstract	Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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