International Electrotechnical Commission

Publication detail

Reference	IEC 61188-5-6 ed1.0 withdrawn corrigendum	> preview
Title	Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Publication date	2003-01-23
Format, price (Swiss francs) and language	100.- 37 pages 100.- 398 Kb
Abstract	Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.190 Electronic component assemblies *Including preassembled modules
Replaced by
Stability date	2014
Work in progress	Project Stage code Forecast publication date No project under development - -

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