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Publication detail

 
Reference IEC 61188-5-6 ed1.0 withdrawn corrigendum
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Title Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Publication date 2003-01-23
Format, price
(Swiss francs)
and language
100.- 37 pages
100.- 398 Kb
 
Abstract Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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