International Electrotechnical Commission

Publication detail

Reference	IEC 60749-19 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Publication date	2003-02-13
Format, price (Swiss francs) and language	20.- 11 pages 20.- 109 Kb
Abstract	Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

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