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Publication detail

 
Reference IEC 60749-19 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Publication date 2003-02-13
Format, price
(Swiss francs)
and language
20.- 11 pages
20.- 109 Kb
 
Abstract Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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