| Reference |
IEC 61192-1 ed1.0 withdrawn corrigendum |
 > preview
|
| Title |
Workmanship requirements for soldered electronic assemblies - Part 1: General
|
| Publication date |
2003-02-20 |
Format, price (Swiss francs) and language |
 | 280.- |
| 147 pages |  | 280.- |
| 2036 Kb |
|
| |
| Abstract |
Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates.
Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies.
Enables achievement of high yields and high product quality through process control in production.
|
| Technical Committee |
91 - Electronics assembly technology
|
| ICS Codes |
| 31.190 |
Electronic component assemblies
*Including preassembled modules |
|
| |
| Replaced by |
|
| Stability date |
2014 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
|