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Publication detail

 
Reference IEC 61192-2 ed1.0 withdrawn corrigendum
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Title Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Publication date 2003-03-14
Format, price
(Swiss francs)
and language
280.- 127 pages
280.- 3540 Kb
 
Abstract Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2014
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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