International Electrotechnical Commission

Publication detail

Reference	IEC 61188-5-2 ed1.0 withdrawn corrigendum	> preview
Title	Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
Publication date	2003-06-24
Format, price (Swiss francs) and language	250.- 103 pages 250.- 1400 Kb
Abstract	Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
Technical Committee	91 - Electronics assembly technology
ICS Codes	31.180 Printed circuits and boards 31.190 Electronic component assemblies *Including preassembled modules
Replaced by
Stability date	2014
Work in progress	Project Stage code Forecast publication date No project under development - -

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