International Electrotechnical Commission

Publication detail

Reference	IEC 60749-25 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
Publication date	2003-07-11
Format, price (Swiss francs) and language	50.- 25 pages 50.- 511 Kb
Abstract	Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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