International Electrotechnical Commission

Publication detail

Reference	IEC 60749-14 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Publication date	2003-08-07
Format, price (Swiss francs) and language	60.- 27 pages 60.- 451 Kb
Abstract	Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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