Publication detail
| Reference | IEC 60749-3 ed1.0 |
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| Title | Versión Oficial En español - Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 3: Examen visual externo. | |||||||||
| Publication date | 2002-04-09 | |||||||||
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| Abstract | Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. | |||||||||
| Technical Committee | 47 - Semiconductor devices
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| Stability date | 2016 | |||||||||
| Work in progress |
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