Publication detail
| Reference | IEC 60749-9 ed1.0 |
no preview |
||||||||
| Title | Versión Oficial En español - Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 9: Permanencia del marcado. | |||||||||
| Publication date | 2002-04-12 | |||||||||
| Format, price (Swiss francs) and language |
|
|||||||||
| Abstract | Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. | |||||||||
| Technical Committee | 47 - Semiconductor devices
|
|||||||||
| ICS Codes |
|
|||||||||
| Stability date | 2016 | |||||||||
| Work in progress |
|
|||||||||
Search
Quick access by ref. number
Basket
| Your basket is empty |
Payment
| Accepted credit cards: | |
 | Prices in CHF (Swiss francs) |
| Request a pro forma to pay by bank transfer or cheque | |
| Learn how to share your publications with your colleagues, using networking options | |
Just Published
- IEC 61275 Ed. 2.0
- IEC 62246-1-1 Ed. 1.0
- IEC 60255-26 Ed. 3.0
- IEC 61970-301 Ed. 4.0
- IEC 61996-1 Ed. 2.0
- IEC 60974-5 Ed. 3.0
- IEC 60601-1-SER Ed. 1.0
>> Published in the last 30 days
Bestsellers