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Publication detail

 
Reference IEC 60191-6-10 ed1.0 withdrawn corrigendum
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Title Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Publication date 2003-11-19
Format, price
(Swiss francs)
and language
50.- 12 pages
50.- 497 Kb
 
Abstract Provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON).
Technical Committee 47D - Semiconductor devices packaging  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2020
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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