| Reference |
IEC 60749-23 ed1.0 withdrawn corrigendum |
 > preview
|
| Title |
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
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| Publication date |
2004-02-23 |
Format, price (Swiss francs) and language |
 | 35.- |
| 17 pages |  | 35.- |
| 388 Kb |
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| Abstract |
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
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| Technical Committee |
47 - Semiconductor devices
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| ICS Codes |
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| Replaced by |
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| Stability date |
2015 |
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| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
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