Publication detail
| Reference | IEC 61249-8-8 ed1.0 |
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| Title | Versión oficial en español - Materiales para estructuras de interconexión - Parte 8: Conjunto de especificaciones seccionales para películas no conductoras y revestimientos - Sección 8: Revestimientos poliméricos temporales | |||||||||
| Publication date | 1997-06-24 | |||||||||
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| Abstract | Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks. | |||||||||
| Technical Committee | 91 - Electronics assembly technology
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| Stability date | 2013 | |||||||||
| Work in progress |
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