Publication detail
| Reference | IEC 60191-6-10 ed1.0 |
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| Title | Versión Oficial En español - Normalización mecánica de dispositivos de semiconductores. Parte 6-10: Reglas generales para la preparación de los diseños de los paquetes de dispositivos de semiconductores de montaje en superficie. Dimensiones de los paquetes P-VSON. | |||||||||
| Publication date | 2003-11-19 | |||||||||
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| Abstract | Provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON). | |||||||||
| Technical Committee | 47D - Semiconductor devices packaging
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| Stability date | 2016 | |||||||||
| Work in progress |
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