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Reference IEC 60191-6-10 ed1.0 withdrawn corrigendum

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Title Versión Oficial En español - Normalización mecánica de dispositivos de semiconductores. Parte 6-10: Reglas generales para la preparación de los diseños de los paquetes de dispositivos de semiconductores de montaje en superficie. Dimensiones de los paquetes P-VSON.
Publication date 2003-11-19
Format, price
(Swiss francs)
and language
50.- 12 pages
50.- 169 Kb
 
Abstract Provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON).
Technical Committee 47D - Semiconductor devices packaging  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2020
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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